AIMBE Fellow; OSA Fellow; SPIE Fellow; Professor of Biomedical Engineering, Professor of Electrical and Computer Engineering, Professor of Oncology, Director of the Biophotonics Imaging Technology Lab (BIT), Johns Hopkins University.

IEEE Fellow; Professor in the Department of Electrical Engineering and Computer Science, Florida Atlantic University; Associate Editor of the ACM Transactions on Knowledge Discovery from Data

Distinguished Professor and Chief Scientist of Aircraft Engineering Design and Research Center, Former Vice Dean of the School of Aerospace Engineering, Xiamen University, China; Elected to the Chinese national high-level talent program; Former Senior Technical Fellow of COMAC Beijing Aircraft Technology Research Institute, and Chief Scientist of Engine Health Management at AVIC Hunan Power Research Institute; Vice Chairman of the Intelligent Composite Materials Professional Committee of the Chinese Society for Composite Materials; Vice Chairman of the Structural Health Monitoring Professional Committee of the Chinese Society for Composite Materials.

Fellow of the Canadian Academy of Engineering; Fellow of the Engineering Institute of Canada; Member of the European Academy of Sciences and Arts; Fellow of the American Society of Mechanical Engineers; Fellow of the Canadian Society for Mechanical Engineering; Percy Edward Hart Professor in the Department of Mechanical and Industrial Engineering, University of Toronto, Canada.

IEEE Fellow; IET Fellow; Professor with the Department of Electrical Engineering at Tsinghua University, Beijing, China; Director of the International Union Research Center of Beijing on Green Energy and Power Safety.

IEEE Fellow; Associate Professor in the School of Engineering and Technology, University of New South Wales, Canberra, Australia. She is Editor-in-Chief of the IEEE Transactions on Geoscience and Remote Sensing.

IEEE Fellow; CSEE Fellow; Professor and Dean, School of Computer Science and Technology, Shandong University

IEEE Fellow; CAAI Fellow; Director of Big Data Institute of Shenzhen University; Professor of Shenzhen University

Fellow of the Canadian Academy of Engineering; IEEE Fellow; ACM Distinguished Member; Professor in the School of Computer Science and William Dawson Scholar (Chair Professor) at McGill University; Founding Director of the Cyber-Physical Intelligence Lab at McGill University; Vice President R&D, Chief Scientist, and Co-Director of the Samsung AI Center Montreal.

Member of the European Academy of Sciences and the Russian Academy of Engineering; Fellow of the American Institute for Medical and Biological Engineering and the Royal Society of Chemistry, and a Distinguished Fellow of the International Technology and Engineering Institute; Vice President and Vice Chairman of the University Council at Shenzhen University, where he is also a University Distinguished Professor (the highest academic rank) in the School of Biomedical Engineering; President at the Shenzhen Institute of Healthcare Security; National Chair Professor at the University of Science and Technology Beijing and Executive President of the National Institute of Precision Medicine and Health in Beijing; Editor-in-Chief of RSC Sensors & Diagnostics and The American Journal of Biomedical Sciences.

AAAI Fellow; ACM Fellow; IEEE Fellow; IAMBE Fellow; IAPR Fellow; AAAS Fellow; AIMBE Fellow; Member of Academia Europaea; Member of the European Academy of Sciences and Arts; Academician of the International Academy of Astronautics; Academician of the International Eurasian Academy of Sciences; Academician of the International Academy for Systems and Cybernetic Sciences; Dean and Professor with the School of Artificial Intelligence, OPtics and ElectroNics (iOPEN), Vice Director of University Academic Committee, Northwestern Polytechnical University, China.

Fellow of the Royal Society of Canada, the Canadian Academy of Engineering, the Engineering Institute of Canada and the IEEE; Foreign Member of the Chinese Academy of Engineering; Past President of the IEEE Communications Society; University Professor with the Department of Electrical and Computer Engineering, University of Waterloo, Canada.

IEEE Fellow; ACM Distinguished Scientist; Michael and Katherine Birck Professor of Electrical and Computer Engineering, Professor of Computer Science (by courtesy), Purdue University; Recipient of the Honda Initiation Grant Award, NSF CAREER Award, Purdue University College of Engineering Early Career Research Award, Purdue University Faculty Scholar, Purdue PRF Innovator Hall of Fame, and Purdue Engineering Most Impactful Faculty Inventors of 2019 and 2020.

Member of Chinese Academy of Engineering; Member of American Academy of Arts and Sciences; Fellow of the Australian Academy of Technological Science and Engineering; Fellow of the National Academy of Inventors; Academician of the International Eurasian Academy of Sciences; IEEE Fellow; CAAI Fellow; Chair Professor of AI Science at Tsinghua University and Dean of Institute for AI Industry Research of Tsinghua University

Member of the Hong Kong Young Academy of Sciences; IEEE Distinguished Lecturer; Professor in the Department of Electronic and Computer Engineering, Director of Center for Smart Manufacturing, Director of HKUST Shenzhen Multi-I Robotic System Lab, Associate Director of HKUST-BYD Embodied AI Joint Laboratory, Associate Director of Research Center of SMART FiberTech, Hong Kong University of Science and Technology; Recipient of the Hong Kong UGC Early Career Award, the “National Excellent Young Scientist”, and recognition in China’s Top 10 Scientific and Technological Advances in Robotics.

Fellow of the Society of Industrial and Applied Mathematics (SIAM); Fellow of the American Mathematical Society (AMS); Ewing-Mobil Chair in Computational Science and Professor of Mathematics at the Department of Mathematics, Director of Institute for Scientific Computation (ISC), Texas A&M University; The 2014 Invited Speaker of the International Congress of Mathematicians.