Member of the European Academy of Sciences and the Russian Academy of Engineering; Fellow of the American Institute for Medical and Biological Engineering and the Royal Society of Chemistry, and a Distinguished Fellow of the International Technology and Engineering Institute; Vice President and Vice Chairman of the University Council at Shenzhen University, where he is also a University Distinguished Professor (the highest academic rank) in the School of Biomedical Engineering; President at the Shenzhen Institute of Healthcare Security; National Chair Professor at the University of Science and Technology Beijing and Executive President of the National Institute of Precision Medicine and Health in Beijing; Editor-in-Chief of RSC Sensors & Diagnostics and The American Journal of Biomedical Sciences.

AAAI Fellow; ACM Fellow; IEEE Fellow; IAMBE Fellow; IAPR Fellow; AAAS Fellow; AIMBE Fellow; Member of Academia Europaea; Member of the European Academy of Sciences and Arts; Academician of the International Academy of Astronautics; Academician of the International Eurasian Academy of Sciences; Academician of the International Academy for Systems and Cybernetic Sciences; Chief Technology Officer (CTO) and Chief Scientist of the China Telecom, Director of the Institute of Artificial Intelligence (TeleAI) of China Telecom.

Fellow of the Royal Society of Canada, the Canadian Academy of Engineering, the Engineering Institute of Canada and the IEEE; Foreign Member of the Chinese Academy of Engineering; Past President of the IEEE Communications Society; University Professor with the Department of Electrical and Computer Engineering, University of Waterloo, Canada.

IEEE Fellow; ACM Distinguished Scientist; Michael and Katherine Birck Professor of Electrical and Computer Engineering, Professor of Computer Science (by courtesy), Purdue University; Recipient of the Honda Initiation Grant Award, NSF CAREER Award, Purdue University College of Engineering Early Career Research Award, Purdue University Faculty Scholar, Purdue PRF Innovator Hall of Fame, and Purdue Engineering Most Impactful Faculty Inventors of 2019 and 2020.

Member of Chinese Academy of Engineering; Member of American Academy of Arts and Sciences; Fellow of the Australian Academy of Technological Science and Engineering; Fellow of the National Academy of Inventors; Academician of the International Eurasian Academy of Sciences; IEEE Fellow; CAAI Fellow; Chair Professor of AI Science at Tsinghua University and Dean of Institute for AI Industry Research of Tsinghua University

Member of the Hong Kong Young Academy of Sciences; IEEE Distinguished Lecturer; Professor in the Department of Electronic and Computer Engineering, Director of Center for Smart Manufacturing, Director of HKUST Shenzhen Multi-I Robotic System Lab, Associate Director of HKUST-BYD Embodied AI Joint Laboratory, Associate Director of Research Center of SMART FiberTech, Hong Kong University of Science and Technology; Recipient of the Hong Kong UGC Early Career Award, the “National Excellent Young Scientist”, and recognition in China’s Top 10 Scientific and Technological Advances in Robotics.

Fellow of the Society of Industrial and Applied Mathematics (SIAM); Fellow of the American Mathematical Society (AMS); Ewing-Mobil Chair in Computational Science and Professor of Mathematics at the Department of Mathematics, Director of Institute for Scientific Computation (ISC), Texas A&M University; The 2014 Invited Speaker of the International Congress of Mathematicians.

Fellow of Chinese Automation Association; Vice Chairman of Hunan Automation Association; Professor and Dean of the School of Automation, Central South University, Changsha, China.

Fellow of the Institute of Physics (UK); Professor and Former Associate Dean for Research of the School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen (CUHK-Shenzhen), and an Honorary Professor at The University of Hong Kong. His honors include World Top 2% Scientists (Stanford, 2020-2025), National High-Level Talent Program-Leading Talent (Thousand Talents, 2015; Ten-Thousand Talents, 2024), the Fok Ying Tung Young Faculty Award, the Shenzhen Natural Science First Prize, and the Guangdong S&T Second Prize. His lab advances topological spintronics and MRAM-based in-memory computing to deliver instant-on, non-volatile, ultra-low-power AI chips for edge and embodied intelligence.

Academician of Chinese Academy of Sciences; IEEE Fellow; Fellow of Chinese Institute of Electronics; Fellow of Chinese Association for Artificial Intelligence; Professor in the Department of Automation, Tsinghua University

IEEE Fellow; Fellow of the International Association of Advanced Materials; Member of the Hong Kong Young Academy of Sciences; Chair Professor of Semiconductor Physics and Associate Dean of Faculty of Science (Research), The Hong Kong Polytechnic University; IEEE Distinguished Lecturer, Vice Chair of IEEE EDS region 10, and Chair of IEEE EDS Nanotechnology Committee.

IEEE Fellow; ISCA Fellow; Senior Principal Scientist at Amazon Alexa AI, USA; Former Computer Science Professor at the University of Texas at Dallas, USA; Former head of LAIX AI lab, China.

IEEE Fellow; Professor at Department of Automation, East China University of Science and Technology, Shanghai, China.

IEEE Fellow; Member of College of Experts (CoE) of the Australian Research Council (ARC); Professor and Dean of Digital Capability Research Platform, Swinburne University of Technology, Australia; Editor-in-Chief of the SpringerBriefs in Information Security and Cryptography.

IEEE Fellow; Professor, School of Information Science and Technology, ShanghaiTech University, China; Co-Director, Shanghai Institute of Fog Computing Technology (SHIFT).

Member of the US National Academy of Sciences, the US National Academy of Engineering, and the French Academy of Sciences; AAAI Fellow; ACM Turing Award Laureate; Silver Professor of the Courant Institute of Mathematical Sciences at New York University; Vice President and Chief AI Scientist at Meta